MKS AX7670-19 Remote Plasma Source

MKS AX7670-19 remote plasma source generates plasma free radicals outside the cavity for semiconductor chamber cleaning and reducing wafer charge damage
Product Features
High gas dissociation efficiency and fast cleaning speed
Remote generation of plasma to protect wafers from ion bombardment
Suitable for fluorine oxygen process gases
Rich and convenient communication interfaces for machine docking
Equipped with temperature and pressure safety interlock protection
Application Areas
In situ cleaning of CVD equipment chamber
Cleaning of PECVD thin film deposition chamber
ALD atomic layer deposition equipment
PVD magnetron sputtering chamber cleaning
Maintenance of semiconductor etching equipment chamber
Cleaning of flat panel display film equipment
Cleaning of storage chip process chamber
Maintenance of photovoltaic thin film equipment chamber
Research plasma cleaning device
Special thin film deposition equipment
Overall, the MKS AX7670-19 remote plasma source has a good cleaning effect and can reduce the risk of wafer damage, which is the core component of semiconductor cavity cleaning