TEL 3M80-003135-13 Printed Circuit Board  

The TEL 3M80-003135-13 printed circuit board is a specialized PCB board for Tokyo Electronic Semiconductor Equipment, responsible for signal relay distribution and level conversion work.
Product Features
1. Multi layer high-density PCB substrate ensures the integrity of high-speed signal transmission
2. Realize signal transfer between the main control unit and sensors/actuators
3. Equipped with electrical isolation design to reduce cavity RF signal interference
4. Complete level conversion and adapt to various types of peripheral signal specifications
5. Three proof protective coating, suitable for temperature and humidity conditions in clean workshops
6. Metallized reinforcement via, stable interlayer connection and less prone to virtual soldering
7. Can transmit temperature, pressure, position and other chamber sensing data back
8. Allocate multiple power supplies and deliver power to downstream submodules
9. Standard backplane connector, easy to plug, replace and maintain
10. Tolerate equipment vibration and support continuous operation of the machine for 7 × 24 hours
Product Parameters
1. Model: TEL 3M80-003135-13
2. Board type: Signal Relay Control Printed Circuit Board
3. Compatible devices: TEL etching CVD、 Wafer processing equipment
4. Connection method: Backplane connector, ribbon cable docking
5. Working environment: Long term operation inside semiconductor equipment cabinets
TEL 3M80-003135-13 printed circuit board runs stably and is a commonly used spare board for TEL semiconductor equipment maintenance and replacement.