YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device

Model:XU-ACP130-B01
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device

Product manual:

YASKAWA XU-ACP130-B01 Yaskawa 300mm wafer pre aligner, precise wafer positioning at semiconductor transfer station, compatible with AMAT process equipment, high-speed and high-precision positioning, with the following features:
1. YASKAWA XU-ACP130-B01 compact integrated machine, with direct disassembly and replacement of equipment workstations
2. Compatible with 300mm standard wafers, compatible with notch/flat edge positioning marks
3. Non contact optical line array scanning for rapid detection of wafer eccentricity and rotation angle
4. The rotating platform is designed with low vibration to avoid wafer slippage and scratches, resulting in extremely low dust production
5. High positioning repeatability accuracy, small angle error, ensuring precise picking and placing of the robotic arm
6. Built in vacuum adsorption stage, stable adsorption, and thin crystal circles are not easily warped or displaced
7. Signal electrical isolation to resist cavity RF and motor electromagnetic interference
8. Integrated multiple safety interlocks for overtravel, vacuum loss, and foreign object detection
9. Dedicated bus docking with robotic arm controller, real-time transmission of alignment coordinate data
10. The whole machine has a stainless steel clean body, corrosion-resistant and suitable for dust-free workshop environment
11. Fast alignment cycle speed, shortened wafer waiting cycle time, and improved production line efficiency
12. Panel status indicator light, quickly identify vacuum, sensor, and motor faults
13. Industrial drive circuit has stable heat dissipation and supports 7 × 24-hour continuous operation
14. Standardized communication and gas source interface, no need to modify existing pipelines for replacement
15. Supporting application material deposition, etching, ion implantation 300mm wafer equipment
ending
YASKAWA XU-ACP130-B01 precise low dust and low vibration alignment, dedicated pre alignment unit for 300mm wafer transfer process.