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AMAT Applied Materials 0040-32530 Cold Plate Component

Brand: AMAT Applied Materials 
Model:0040-32530
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

AMAT Applied Materials 0040-32530 Cold Plate Component

Product manual:

AMAT Applied Materials 0040-32530 Cold Plate Component
Product Overview

0040-32530 is a Cold Plate Assembly in AMAT semiconductor equipment, used for thermal management of critical process modules or wafer carrier platforms. The cold plate component quickly conducts and dissipates the heat inside the equipment or on the surface of the wafer through efficient heat conduction and liquid cooling systems, thereby maintaining stable process temperature and ensuring equipment and wafer safety.

Technical functions and features

Efficient thermal management

By designing liquid or water-cooled pipelines, rapid heat conduction and dissipation can be achieved.

Maintain stable temperature of process modules or wafer platforms to prevent thermal drift from affecting process quality.

Precise Temperature Control

It can be linked with temperature sensors, controllers, or power modules to achieve closed-loop temperature control.

Support high-precision temperature regulation to meet the requirements of microelectronics and semiconductor processes.

Modular structure

The design is easy to disassemble and maintain, making it convenient for equipment upgrades or replacement of cooling media.

Adapt to semiconductor cleanroom standards to prevent contamination and particle diffusion.

Security and protection

Built in overheating or cooling abnormal alarm mechanism to prevent damage to wafers or equipment.

It can be linked with the device interlock system to achieve automatic shutdown protection.

Application field

Cooling of wafer carrier platform

Provide temperature control for ESC (electrostatic chuck) or wafer support platform to ensure stable wafer processing temperature.

Heater and process module temperature control

Cooperate with hot ion heaters, heating plates, or other heating modules to prevent overheating.

Semiconductor equipment temperature control system

Realize local or overall temperature control in deposition, etching, cleaning, and other process modules.

Automated production line auxiliary cooling

Heat dissipation for elevators, pneumatic modules, or power electronic modules to ensure stable operation of the equipment.

AMAT Applied Materials 0040-32530 Product details picture:

0040-32530

AMAT Applied Materials 0040-32530 product video

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