AMAT Applied Materials 0100-40024 Interconnect Board

Brand: AMAT Applied Materials
Model:0100-40024
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

AMAT Applied Materials 0100-40024 Interconnect Board

Product manual:

AMAT Applied Materials 0100-40024 Interconnect Board
1、 Product Overview

AMAT 0100-40024 is a system interconnect board produced by Applied Materials
（Interconnect Board）， Used for signal distribution and electrical connection between modules in semiconductor manufacturing equipment.
It belongs to the core communication and power relay components in the machine control system,
Mainly responsible for centralized connection and management of electrical signals between main control units, I/O modules, power modules, sensors, actuators, and other devices.

2、 Product Features

Signal and Power Distribution Center

Unify the distribution of analog signals, digital signals, and power signals between the main control system (such as the main CPU control board) and each submodule.

Implement orderly transmission of control instructions, feedback status, and power supply.

Interface conversion and isolation

Supports conversion of multiple signal types (TTL, RS-485, analog, digital).

Built in isolation circuit to prevent electrical interference and grounding circuit noise between different modules.

Modular system integration

Provide standardized connection interfaces for AMAT's various process modules (gas control, vacuum control, RF power supply, heating control, etc.).

Make equipment maintenance and module replacement more convenient.

System Security and Protection

Integrate overcurrent, overvoltage, and short-circuit protection mechanisms to ensure downstream circuit safety.

Provide state isolation in case of communication abnormalities or power fluctuations to avoid cascading failures.

3、 Product Features

Highly reliable multi-layer PCB design

Adopting a multi-layer circuit board structure (usually 6 or more layers), the signal layer is independently arranged from the ground layer to reduce crosstalk and signal reflection.

Optimize power distribution and grounding design to improve signal integrity and anti-interference performance.

Modular connection interface

Onboard multiple standard connectors (such as backplane slots, IDC interfaces, D-Sub interfaces, etc.).

Support plug and play connection between the main backplane and functional modules (Controller, I/O Board).