AMAT Applied Materials 0190-11570 RF Matcher

Brand: AMAT Applied Materials
Model:0190-11570
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

AMAT Applied Materials 0190-11570 RF Matcher

Product manual:

Product Overview

The AMAT Applied Materials 0190-11570 RF Matching Network is a key RF subsystem used in semiconductor process equipment such as plasma etching, chemical vapor deposition, etc. Its main function is to match the impedance between the RF power output and the plasma load, thereby maximizing power transmission efficiency, reducing reflected power, and maintaining stable plasma operation.

Technical parameters (common characteristics, specific values may vary depending on version)

Operating frequency: Typically 13.56 MHz or multi frequency RF systems (may support secondary frequencies of 2 MHz, 27 MHz, etc.).

Power Range: Typically supports RF power transmission ranging from several hundred watts to several kilowatts.

Control mode: automatic matching (built-in control circuit) or controlled by an external main control system.

Cooling method: Some models may use air or water cooling to ensure long-term stable operation.

Version revision: 0190-11570 may have different revisions (Rev A, Rev B, etc.), with adjustments made to circuit parameters, control interfaces, or power levels.

Application scenarios

Plasma etching system: Provides stable RF power to the cavity plasma, maintaining etching rate and uniformity.

Chemical Vapor Deposition (CVD): Ensure plasma uniformity during the deposition process and improve film quality.

Ion implantation and ashing process: In process modules that require RF plasma, power matching is provided to ensure stable discharge.

AMAT equipment platform: a specific machine series designed for Applied Materials, used in conjunction with its RF power supply and chamber system.

Product advantages

Efficient energy transmission: By automatically matching impedance, the reflected power is significantly reduced and the RF power utilization efficiency is improved.

High stability: Ensure long-term stable operation of the cavity plasma, improve process consistency and yield.

Modular design: Independent RF matching unit for easy replacement and maintenance, reducing equipment downtime.