AMAT Applied Materials 0190-24680 Panel Temperature Controller

Brand: AMAT Applied Materials
Model:0190-24680
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

AMAT Applied Materials 0190-24680 Panel Temperature Controller

Product manual:

1、 Product Overview

AMAT Applied Materials 0190-24680 is a panel temperature controller,
Mainly used for precise temperature control of heating chambers, process chambers, gas panels, and other thermal control areas in semiconductor equipment.

In AMAT's CVD, PVD, Etch, CMP and other equipment platforms,
0190-24680 is one of the important components for maintaining process stability,
Ensure that material deposition, etching, or reaction processes are carried out under optimal temperature conditions.

2、 Technical parameters

Product type: Digital Temperature Controller

Input type: K-type, J-type thermocouple or PT100/RTD signal input

Output mode: Relay output/SSR (Solid State Relay) drive/Analog voltage output (depending on device configuration)

Display mode: LED digital display (set value SV and actual value PV are displayed simultaneously)

Control accuracy: ± 0.1% F.S. (typical)

Adjustment method: PID automatic adjustment (with self-tuning function)

Power specifications: 24 VDC or 100-240 VAC (depending on device version)

Installation form: panel embedded (standard 1/8 DIN or 1/4 DIN size)

Working temperature range: 0-50 ℃ (controller environment)

Main interfaces: front panel setting keys, display screen; Rear signal input/output terminal

3、 Product application areas
Application field specific purpose and functional description
Semiconductor manufacturing equipment
Used to control the temperature of process chambers, gas pipelines, substrate stages, or heating plates to ensure thermal uniformity and stability during deposition or etching processes.
Chemical Vapor Deposition (CVD) System
Adjust the temperature of the reaction chamber to control the growth rate, composition uniformity, and stress characteristics of the thin film.
Physical Vapor Deposition (PVD) System
Control the temperature of the sputtering source, substrate heating stage, or baffle heater to ensure the adhesion and crystallization quality of the metal or dielectric film.
Etch System
Manage the chamber wall temperature and electrode temperature to maintain gas chemical reaction equilibrium and stable ion energy distribution.