AMAT Applied Materials 0680-01169 Heater

Brand: AMAT Applied Materials
Model:0680-01169
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

AMAT Applied Materials 0680-01169 Heater

Product manual:

1、 Product Overview

AMAT Applied Materials 0680-01169 heater is an electric heating component designed to provide thermal energy for semiconductor equipment vacuum chambers and process components.
This heater is commonly used in equipment such as CVD, PVD, Etch (etching), etc. It is mainly used to maintain a constant temperature state of the chamber, base, or process gas to ensure process accuracy and deposition uniformity.
Its structure integrates heating resistor elements and temperature sensing protection devices (Thermistor or Thermal Sensor), which can achieve rapid heating and precise temperature control.

2、 Technical parameters
Project parameter description
Product model 0680-01169
Product Type: Heater Assembly
Functional heating and temperature detection
Rated voltage AC 240 V (three-phase)
Rated current 15 A
Frequency 50/60 Hz
Integrated heating plate or annular heating component in structural form
Heating element resistance wire/ceramic heating core (high temperature type)
Monitoring method with built-in thermistor or thermocouple interface
Temperature control range: normal temperature -400 ° C (typical process temperature zone)
Material characteristics: high-purity aluminum alloy or ceramic substrate, with vacuum compatibility
Installation method: fixed with flange or bracket, with quick plug port
Applicable environments include vacuum process chambers, gas transport panels, wafer transport platforms, etc
3、 Application scenarios

Chemical Vapor Deposition (CVD) System
Used for temperature control in gas reaction zones and substrate heating zones to ensure stable film growth rate and composition.

Physical Vapor Deposition (PVD) System
Stabilize the temperature of the target material and cavity wall, reduce metal vapor condensation and uneven deposition.

Plasma etching equipment (Etch)
Control the temperature of the inner wall and base of the reaction chamber, optimize the etching rate and contour accuracy.

Gas pipeline and valve group heating
Prevent process gas from condensing in the pipeline and maintain flow accuracy.