KLA Tencor 14-017697 wiring board

Brand:KLA-Tencor
Model:14-017697
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

KLA Tencor 14-017697 wiring board

Product manual:

KLA Tencor 14-017697 wiring board
Product Type: Breakout Board
Applicable equipment: Thermawave Opti Probe 5xxx series wafer inspection equipment
Functional positioning: Signal distribution and electrical connection management module

Product application areas
Internal signal management of wafer testing equipment

As a critical electrical connection unit within the device, the 14-017697 terminal block is responsible for connecting multiple sensors
The cables of the actuator, power supply, and control module are centrally managed and reasonably allocated to each functional module.

Ensure that high-frequency, analog, and digital signals in the detection equipment can be accurately detected
Efficient transmission enhances system stability and reliability.

Equipment maintenance and troubleshooting support

Terminal block design typically features modular layout and clear labeling,
Facilitating technicians to quickly locate the source of problems during daily maintenance and troubleshooting, effectively reducing equipment downtime.

During on-site maintenance, the board can also be used to quickly disconnect or replace specific component connections,
Improve service efficiency.

Equipment function expansion and transformation

When upgrading or renovating equipment (such as replacing light source systems, expanding acquisition channels, etc.),
This patch panel can provide reserved interfaces or adapter support, enhancing system flexibility and compatibility.

Meet the diverse and customized needs of semiconductor manufacturers for production lines.

Signal integrity and anti-interference guarantee

The onboard wiring considers factors such as isolation of different signals and electromagnetic compatibility (EMC),
It can effectively reduce issues such as crosstalk and signal loss, and improve system detection accuracy.

This is particularly crucial for high-sensitivity detection tools, such as measuring process layer thickness and monitoring reflectivity.