KLA Tencor 720-21216-003 Scanner Module

Brand:KLA-Tencor
Model:720-21216-003
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

KLA Tencor 720-21216-003 Scanner Module

Product manual:

KLA Tencor 720-21216-003 Scanner Module
It is a key component designed specifically for KLA Tencor's high-end semiconductor wafer inspection and measurement equipment,
Responsible for implementing optical or laser scanning motion on high-precision platforms.
It is commonly used in wafer surface inspection systems such as Surfscan, e-beam, or AOI systems
In the middle,
It is one of the core components for implementing sub micron level positioning and image acquisition in the system.

1、 Basic Product Information
Product model: 720-21216-003

Product type: Scanner Module

Manufacturer: KLA Tencor

Platform: 720 Series Wafer Inspection and Measurement Equipment

2、 Core functions and roles
Function category description
Scanning control enables linear or spiral scanning of the platform or optical components to ensure that the image covers the entire wafer surface.
Position feedback with built-in encoder/laser interferometer feedback system, achieving closed-loop control and improving positioning accuracy.
Synchronize triggering with cameras or laser sensors to accurately trigger image acquisition or data recording.
Dynamic adjustment can dynamically adjust scanning speed, acceleration, path, and step interval according to system instructions.

3、 Application Fields
1. Wafer Inspection System
Control the scanning path of the detection head or wafer platform to ensure that the entire wafer is covered for detection.

Closely integrated with the light source, imaging head, and data processing system, supporting high-speed movement and high-frequency sampling.

2. Optical measurement system (Metrology Tools)
Used for precise measurement of geometric characteristics such as wafer thickness, roughness, and morphology.

Provide high-resolution control capability in the Z-axis or tilt axis direction.

3. E-beam or laser imaging equipment
Control the scanning of beam spot on the wafer, suitable for high contrast image acquisition and electrical performance evaluation.

4. Automatic Optical Inspection (AOI) Platform
Realize fast scanning imaging to identify micro/sub micron level defects such as particle contamination, scratches, and etching defects.