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TEL Tokyo Electron 1B80-002392-11 Interface Board

Brand:TEL Tokyo Electron
Model:1B80-002392-11
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

TEL Tokyo Electron 1B80-002392-11 Interface Board

Product manual:

Product Name: TEL Tokyo Electron 1B80-002392-11 Interface Board
Category: Electronic Interface Module/Interface Board
Manufacturer: Tokyo Electron Limited (TEL)

1、 Product Function Overview
TEL interface boards are commonly used in semiconductor manufacturing equipment as core modules for signal exchange, communication bridging, and system collaborative control. They mainly achieve the following functions:

Provide electrical connections between the control unit and the actuator

Convert and relay signals from sensors, actuators, or external subsystems

Format conversion, buffering, or logical judgment of signals

As part of system interlocking, error detection, and linkage control

2、 Typical application areas
1. Thin film deposition equipment (CVD/ALD/PVD)

Used for data and control signal transmission between gas flow control units (MFCs), heating platforms, valve actuators, and main control systems.

2. Plasma Etcher

Connect RF power supply, vacuum chamber controller, temperature controller and main control module;

Implement the transmission, reception, and control of process monitoring signals.

3. Wafer Cleaners

Connect spray devices, liquid valve groups, electric actuators, etc;

Realize multi-channel sensing and control.

4. Wafer Transfer Module

Coordinate the communication between the robotic arm, position sensor, motor driver, and control system;

Ensure high-precision transmission of wafers in a vacuum environment.

5. Lithography and Exposure Equipment

Manage the signal transmission between the exposure head, electric focusing platform, UV source, and control system;

Provide stable interface logic.

3、 Product Features
Multi channel signal interface, supporting mixing of analog and digital signals

High durability design, suitable for harsh semiconductor manufacturing environments such as vacuum and high temperature

Highly integrated with TEL system control architecture

Supports multiple standard connectors (such as DF9, HRS, ZIF interface, etc.)

Product details picture:

1B80-002392-11

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