TEL Tokyo Electron 2180-020950-11 Control Motherboard Module

Product manual:

1、 Basic Information
Product model: 2180-020950-11

Product Name: Main Control Board Module

Manufacturer: Tokyo Electron Limited (TEL)

Module Category: Central Processing Control Board/System Main Control Module

Version number: -11 (representing the 11th revision of this motherboard)

2、 Main functions
This module is one of the core control components in TEL equipment, responsible for the main tasks of overall process, action flow, and signal processing.

Functional classification description
The central control function serves as the "brain" of the device, executing the main program, action logic, and device status control
Interface management manages the interaction between subsystems such as input/output modules, sensors, drivers, and communication units
Real time processing of collected data for calculation, judgment, and decision output

3、 Typical application areas
This control motherboard module is widely used as the main control platform in the following TEL devices:

ACT series lithography auxiliary processing equipment

For example, ACT8, ACT12, ACT18 are used to control the process steps of gluing, developing, pre drying, and post drying

Tactras series etching equipment

Coordinate the control of chamber gas flow rate, vacuum, RF power, and temperature control system

Trias SPA/Trias TI series CVD/ALD deposition equipment

Perform multi-step temperature control, gas mixing, and sedimentation time series control

Loadport, Transfer, EFEM modules

Control wafer handling path, robotic arm position, and linkage protection logic

4、 Technical features
Industrial grade embedded architecture, stable and reliable, suitable for continuous operation in cleanrooms

Multi channel signal interface, supporting digital/analog I/O, encoder feedback, pulse counting, etc

The onboard processor has multitasking capability and strong real-time performance

Version 11 (-11) represents firmware and circuit optimization versions to ensure compatibility with the latest devices/modules

Highly integrated design, supporting hot swapping and modular maintenance

Product details picture:

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