TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board

Product manual:

1、 Product functional positioning
The 2L08-050066-12 printed circuit board (PCB) is a critical electronic component in Tokyo Electron semiconductor equipment,
Usually used to carry functional modules such as control logic, power distribution, signal processing, etc,
It is the basic platform for internal signal and power transmission of equipment.

2、 Main application areas
1. Core circuit support for equipment control system
Used as a motherboard or daughter board for control systems, carrying key components such as MCU, FPGA, I/O control chips, etc;

Implement logical control and state coordination of various subsystems in wafer processing equipment (such as etching machines, CVD, coating and developing machines).

2. Signal acquisition and interface conversion
Integrate multiple sensor interfaces, AD/DA modules, and communication ports;

Act as a bridge in the device, connecting the execution components such as temperature control system, air pressure control, motor drive module, etc. with the central controller.

3. Power allocation and voltage regulation filtering function
Carrying power modules and stabilizing circuits, providing stable low-voltage DC power for other functional boards;

Realize the allocation of different voltage levels, overload protection, and electromagnetic interference suppression.

4. System communication and bus integration
Provide internal communication bus interfaces such as I ² C, SPI, RS-485, CAN, etc;

Support high-speed data exchange between the main control system and external devices.

3、 Typical application devices
Plasma etching system (Etcher)
Control gas flow rate, electrode voltage, vacuum system and other aspects.

Thin film deposition equipment (CVD, ALD)
Manage process parameters such as temperature, time, and reactant injection.

Coater/Developer
Used to control rotation speed, development time, exposure area recognition, etc.

Device communication relay and data distribution node
Can serve as a communication node for multiple sub modules within the system, improving data coordination efficiency.

Product details picture:

2L08-050066-12

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