TEL Tokyo Electron 308-500221-1 Fiber Interface Board

Brand:TEL Tokyo Electron
Model:308-500221-1
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

TEL Tokyo Electron 308-500221-1 Fiber Interface Board

Product manual:

TEL Tokyo Electron 308-500221-1 Fiber Optic Interface Board
It is a high-speed fiber optic communication interface board used in Tokyo Electron semiconductor equipment,
Mainly responsible for fiber optic data transmission within the equipment or between external systems.
It supports high bandwidth, low latency data communication and is widely used in process control systems
Image processing modules, remote diagnostics, and other applications that require high real-time performance.

The following is a detailed explanation of the product's application areas (without patterns):

1、 Basic Information
Product model: 308-500221-1

Product Name: Fiber Optic Interface Board

Manufacturer: Tokyo Electron Ltd. (TEL)

Function category: Communication/Data Transmission Module

Board type: High speed digital signal transmission board (photoelectric conversion type)

2、 Main functions
Fiber optic data transceiver interface

Realize the mutual conversion between electronic signals and optical signals;

Supports single-mode or multi-mode fiber optic input and output for high-speed data exchange.

Data synchronization and real-time feedback

Provide a low latency communication mechanism to ensure that the system response time meets the precision requirements of semiconductor processes;

Support data integrity verification and clock synchronization mechanism.

Safety and electrical isolation

By utilizing the natural electrical isolation properties of optical fibers, high voltage interference or surge propagation between devices can be prevented;

Reduce the failure rate of device communication interfaces.

3、 Typical application scenarios
TEL etching equipment (Etcher)

High speed optical communication for high-frequency RF control signals or cavity status feedback with the main control system.

CVD/ALD and other deposition systems

Connect remote control modules (such as temperature control system, reaction gas module) for parameter data synchronization.

Image recognition system or sensor array

Transmitting high-resolution images or positional data, such as for wafer alignment and image matching control.