TEL Tokyo Electron 3208-000089-12 connector module
Brand:TEL Tokyo Electron
Model:3208-000089-12
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details
TEL Tokyo Electron 3208-000089-12 connector module
Product manual:
product name
TEL Tokyo Electron 3208-000089-12 connector module
Product Type: Connector Module/Interface Connection Module
Manufacturer: Tokyo Electron Ltd. (TEL)
1、 Product Function Introduction
This connector module is typically used as a physical and electrical connection interface between signal, power, or control systems, and is used within TEL semiconductor equipment for:
Connect the main control circuit board with subsystem modules (such as valve control unit, heating unit, sensor array)
Provide stable multi pin or multi wire electrical connections
Support high-speed and low interference data and control signal transmission
Quick plug-in design, easy to maintain and replace
2、 Typical application areas
1. Gas delivery and mass flow control system (MFC)
Connect the mass flow controller, solenoid valve, pressure sensor to the main control board
Realize precise communication of gas control circuit
2. Vacuum chamber control system
Connecting modules such as cavity sensors, gate valves, pump controllers, etc. in plasma etching equipment and CVD systems
Provide shielding interfaces to ensure that signals are not interfered with
3. Wafer processing modules (Loadlock, Transfer)
Connect components such as temperature control platform, motor, position detection sensor, etc
Realize multi axis precision control and feedback
4. Power and signal management system
Used for signal cable docking between power distribution board and control system
Support high current and low impedance connections to ensure stable power supply
5. I/O interface platform
Centralize the management of I/O signals from multiple subsystems and connect them to the main control system or PLC
Modular and rapid replacement can be achieved during faults or maintenance
3、 Product Features
High density multi-channel design: supports parallel transmission of multiple signals or power channels
Strong anti-interference ability: adaptable to complex electromagnetic environments inside semiconductor equipment
Easy to replace: modular card slot design reduces equipment downtime for maintenance
High reliability: industrial grade connection accuracy and mechanical stability
Product details picture:
3208-000089-12
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