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TEL Tokyo Electron 3D81-000102-V1 Interface Board

Brand:TEL Tokyo Electron
Model:3D81-000102-V1
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

TEL Tokyo Electron 3D81-000102-V1 Interface Board

Product manual:

1、 Product functional positioning
3D81-000102-V1 interface board
It is an important component used for signal conversion, control communication, and module interconnection in Tokyo Electron semiconductor manufacturing equipment.
It serves as a data bridge between the device control system and external execution units, playing a role as a "control center extension" during the operation of the device.

2、 Main application areas
1. Communication interface between device modules
Function description: Integrate the main control system (such as the main controller and processor module) with subsystems
(such as gas control unit, temperature control module, motor controller) connection;

Application value: Ensure signal integrity and synchronous operation between various functional modules, improve system response speed and overall collaboration capability;

Typical equipment: used in TEL etching machines, CVD equipment, developing systems, etc.

2. I/O signal input/output distribution and management
Function description: Responsible for collecting data from sensors, actuators (such as solenoid valves, servo motors, etc.)
Input signals and output control signals;

Interface type: may include digital quantity (DI/DO), analog quantity (AI/AO), communication port
(such as RS-232, RS-485, CAN, Ethernet, etc.);

Application scenarios: temperature control, airflow regulation, pressure detection, motor drive signal interaction, etc.

3. Multi system collaborative control bridge unit
Collaboration: Support data interconnection among multiple subsystems to achieve synchronous control of overall device operation;

Bus support: may embed support for standard industrial communication protocols such as I ² C, SPI, MODBUS, SECS/GEM, etc;

Process assurance: Ensure the coordinated operation of various subsystems during wafer processing to avoid delays or interference.

4. System maintenance and expansion interface platform
Easy maintenance: Interface boards are usually designed with standardization and modularity, making it easy to quickly plug and replace and diagnose the system;

Extended support: Supports adding modules, optimizing signal routing, or upgrading functions to meet device configuration adjustment needs.

Product details picture:

3D81-000102-V1

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