TEL Tokyo Electron 3M87-024252-23 Controller Module
Brand:TEL Tokyo Electron
Model:3M87-024252-23
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details
TEL Tokyo Electron 3M87-024252-23 Controller Module
Product manual:
TEL Tokyo Electron 3M87-024252-23 Controller Module
It is a control core unit module applied in semiconductor manufacturing equipment,
Mainly used for unified management of various functional modules of equipment (such as gas system, temperature control system, motion mechanism, etc.)
Logical operations and control instruction issuance are key components in achieving automated precision process control.
1、 Basic Information
Product model: 3M87-024252-23
Product Name: Controller Module
Manufacturer: Tokyo Electron Ltd. (TEL)
Module Type: Embedded Control System Components/Process Control Cards
Applicable platforms: May be used for TEL coating/developer, CVD, Etcher, or ALD systems, etc.
2、 Core functions
Process control
Run TEL device control logic to manage the start stop, switching, timing, synchronization, etc. of each process step.
Peripheral module coordination
Collaborate with I/O board, air valve control board, driver module, temperature control board, etc. to execute logical action control.
Equipment status monitoring and feedback
Real time collection of the operating status of each subsystem, and making judgments, feedback, or alarms based on set conditions.
Communicate with the main system
Interact data with the host or upper system through system buses such as TEL dedicated buses, Ethernet, CAN, etc.
Embedded program running
Internally, it may be equipped with embedded processors and fixed software for executing specific process control programs.
3、 Typical application areas
Coater/Developer system
Control the rhythm and condition judgment of wafer transfer, rotation, coating, and development steps.
CVD/ALD equipment
Manage the switching of reaction gases, temperature settings, and the rhythm logic of the deposition process.
Plasma etching system
Control key parameters such as plasma source on/off, RF power status, chamber pressure and airflow regulation.
Rear packaging/cleaning module
Implement fluid/solution control, pump valve switching, circulation time control, waste liquid discharge and other operational management.
Product details picture:
3M87-024252-23
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