TEL Tokyo Electron 5044-000223-11 Interface Module

Brand:TEL Tokyo Electron
Model:5044-000223-11
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
Please contact Yvonne for quotation, thank you!

Details

TEL Tokyo Electron 5044-000223-11 Interface Module

Product manual:

Introduction to TEL Tokyo Electron 5044-000223-11 Interface Module
1、 Basic Information
Model: 5044-000223-11

Alias: APC-T0095A-11 Interface Board (BOARD, CONN ADH CHEM # 05)

Manufacturer: Tokyo Electron Ltd. (TEL)

Function category: Interface connection board, responsible for signal and power transmission between modules

2、 Function Description
Signal bridging
Used for signal connection and forwarding between various subsystems within semiconductor equipment, such as chemical supply systems, gas control units, etc.

power distribution
Provide voltage and current distribution functions to support the connection of multiple small modules or sensors.

Structured connection
Adopting standardized PCB board form, modular integrated installation is achieved by inserting the motherboard through the backplane or slot.

3、 Typical application scenarios
Widely used in chemical supply or gas control systems in semiconductor equipment
——ADH CHEM # 05 "indicates that this board may be used for connection control of chemical pumps or valves

Often used as equipment maintenance replacement parts, suitable for modular maintenance and expansion

Integrate the I/O part of TEL control host racks (such as Trias, Alpha series, etc.)

4、 Characteristics and precautions
Compatibility: When replacing, it is necessary to confirm that the interface type, voltage level, and device slot specifications are consistent, otherwise it may cause functional mismatch

Installation suggestion: It is recommended to operate in a power-off state to ensure that the socket is aligned and in good contact

Test verification: Perform power on/off or signal circuit testing after installation to ensure normal operation

Maintenance: Regularly check the cleanliness of solder joints and contact surfaces to prevent dust or looseness from causing unstable signals