TEL Tokyo Electron BX80-000063-V1 Controller Rack

Product manual:

1、 Basic Information
Product model: BX80-000063-V1

Product Name: Controller Rack

Manufacturer: Tokyo Electron Limited (TEL, Tokyo Electronics, Japan)

Version number: V1 (representing version 1 or first generation structural version)

2、 Product Definition and Function

Functional category description
The module installation platform provides standard card slots or brackets, supporting the installation of control boards, I/O modules, power modules, etc
The internal power distribution may integrate a backplane power bus to provide stable power supply for each module
The signal backplane supports providing multi-channel signal buses or connection slots to achieve communication connections between modules
Structural support ensures that the circuit board module is firmly fixed in the equipment, anti vibration and anti loosening

3、 Typical application scenarios
This rack is typically used in TEL semiconductor equipment control systems of the following types:

ACT series (photolithography auxiliary processing equipment)

Trias, Tactras series (CVD/Etch equipment)

Wafer Handling System (EFEM, Load Port, Transfer Module)

In the above equipment, this rack is used for integrating:

Main control board (such as CPU board, I/O board)

Communication modules (such as RS-232/422/485, Ethernet, TEL bus)

Digital and Analog Interface Board

Power module (AC/DC, 24V power supply, etc.)

4、 Product Features
Adopting TEL specific standard dimensions and card slot layout to ensure module compatibility and hot swappable functionality

High strength industrial aluminum alloy or stainless steel structure, corrosion-resistant and anti-interference

Internally equipped with backplane bus or motherboard slots to achieve unified power supply and data exchange of modules

V1 version represents the initial structural version, suitable for early systems, and some structures may differ from V2/V3

Suitable for cleanroom environments, designed to meet the electromagnetic compatibility and dust prevention requirements of semiconductor equipment

Product details picture:

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