Tokyo Electron FPF07P-AC100E Ultrasonic Device
Brand:TEL Tokyo Electron
Model:FPF07P-AC100E
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details
Tokyo Electron FPF07P-AC100E Ultrasonic Device
Product manual:
Tokyo Electron FPF07P-AC100E Ultrasonic Transformer Unit
It is a key cleaning component integrated into TEL wet cleaning or developing equipment,
Mainly used for non-contact, high-precision cleaning of wafer surfaces through ultrasonic cavitation effect.
This model is suitable for cleaning processes in the front or middle stages of wafers, which can significantly improve particle removal efficiency and yield.
1、 Basic Product Information
Product Name: Ultrasonic cleaner/Ultrasonic cleaning head
Product model: FPF07P-AC100E
Manufacturer: Tokyo Electron Ltd. (TEL)
Working voltage: AC 100V (inferred from the model)
Applicable location: in modules such as wafer cleaning chamber, developing tank, and delamination tank
2、 Core functions
Efficient particle removal
By high-frequency vibration, tiny cavitation bubbles are formed in the liquid to remove pollutants such as particles, residual glue, and metal ions from the wafer surface;
Effectively used for removing fine particles below 0.1 μ m.
Non contact cleaning
Not causing physical contact with the wafer, suitable for device structures that are extremely sensitive to surface stress in advanced processes (FinFET, EUV).
Support chemical solution cleaning
Can be combined with deionized water (DIW), ozone water SC-1、SC-2、 Dilute hydrofluoric acid and other cleaning solutions for use.
Security control mechanism
Integrated linkage functions such as temperature control, liquid level detection, and power protection;
Support communication with the main device, automatic start stop and alarm feedback.
3、 Typical application areas
Purpose of use during the application process stage
After photolithography, develop and clean to remove residual adhesive and development by-products
After etching, clean to remove metal particles and residual oxide deposits
Clean and remove polishing solution residue after CMP to prevent wafer scratches
Wet bench wet equipment as an integrated cleaning unit at the bottom or side of the liquid tank
Product details picture:

FPF07P-AC100E
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